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Features
- Provides BNC Connections to Commonly Used Signals
- Available in Both Passive and Active Operations
- Access Up to Four Bit Synchronizer Input Ports
- Internal AGC for Support of IRIG Time
- 1U Rack-mountable
- Supports Both RS-422 and TTL Decom Interface
- Both Manual and Automatic Patching
Introduction
Series-3000 systems have a wide array of signal input and output cards available. Each of the cards has a complete pin-out of signals. These signals support the user’s need for both inputting the signal for acquisition as well as outputting the result for further use. The CHS3K-BOP series of breakout panels provides quick and easy signal connection. These one- and two-stream panels support PCM bit synchronization and PCM decommutation and provide an AGC circuit for tight control of the IRIG A, B, or G input levels used by the PCM decom cards.
Connections to the signals are supported for both TTL and RS-422. The TTL connections are supported with standard BNC connectors; however, since the standard PCM Decom is equipped with both TTL and RS-422 inputs, a 9-pin D-sub connector is located on the front for easy access to the decom’s RS-422 input ports.
Another popular feature is the automatic patching capability. Located on the front panel of the CHS3K-BOP series is a switch that automatically connects bit sync outputs to decom inputs. This eliminates possible cable patch problems. However, when the user needs to input data directly to the decom (such as during digital tape playback or when providing support for data decoding devices) direct access to the decom data and clock input ports is immediately available.
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Inputs |
Data Sources |
2 NRZ-L and 2 clock signals |
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Signal Levels |
In accordance with standard TTL |
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Speed |
PCM data and clock to 30 Mbps
Time to 400 MHz |
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Output |
Data Signals |
2 NRZ-L and 2 clock signals |
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Signal Levels |
In accordance with standard TTL |
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Speed |
PCM data and clock to 30 Mbps
Time to 400 MHz |
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Electrical &
Environmental |
Form Factor |
1 U, RETMA standard |
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Connectors |
High-density D-sub to cards |
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BNC connections at front panel |
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Operating Temperature |
32 °F to 158 °F (0 °C to 70 °C) |
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Storage Temperature |
14 °F to 185 °F (-10 °C to 85 °C) |
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Operating Altitude |
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Storage Altitude |
0 to 10,000 feet (0 to 3,100 meters) |
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Humidity |
20 to 95% noncondensing |
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Ordering Information |
CHS3K-BOP-100 |
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CHS3K-BOP-200 |
Dual-stream operation |
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CHS3K-BOP-300 |
PCI Simulator, 2 streams
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